钨铜板　W**-W*3

Tungsten copper W**-W*3

钨和铜组成的合金。常用合金的含铜量为*0％～*0％。合金用粉末冶金方法制取，具有很好的导电导热性，较好的高温强度和一定的塑性。在很高的温度下，如***0℃以上，合金中的铜被液化蒸发，大量吸收热量，降低材料表面温度。所以这类材料也称为金属发汗材料。

The composition of the alloy of tungsten and copper. The quantity of copper containing alloys used for *0% ~ *0%. Alloy by powder metallurgy method for preparing, has good conductivity, good high temperature strength and plasticity. At very high temperatures, such as ***0 ℃, an alloy of copper by the liquid evaporation, absorb a large amount of heat, reduce the surface temperature of material. This kind of material, also known as metal sweating material.

　　钨铜合金有较广泛的用途，主要是用来制造抗电弧烧蚀的高压电器开关的触头和火箭喷管喉衬、尾舵等高温构件，也用作电加工的电极、高温模具以及其他要求导电导热性能和高温使用的场合。

Tungsten copper alloy is widely used, mainly used in the manufacture of high voltage electrical switch arc ablation resistance of contact and the rocket nozzle throat, rudder, high-temperature components, electrode, as well as the processing power of the mold temperature and other occasions for thermal conductivity properties and high temperature service.

工艺介绍

Technology introduced

　　钨铜或钼铜混合粉末经过压制成型后，在********0°æ¶²ç›¸çƒ§ç»“。此法制备的材料均匀性不好、存在较多闭空隙，致密度通常低于*8％，但通过添加少量镍的活化烧结法、机械合金化法或者氧化物供还原法制备超细、纳米粉末能提高烧结活性，从而提高钨铜、钼铜合金的致密度。但镍活化烧结会使材料的导电、导热性能显著降低，机械合金化引入杂质也会降低材料传导性能；氧化物共还原法制备粉末，工艺过程繁琐，生产效率低下，难以批量生产。钨、钼骨架熔渗法：先将钨粉或钼粉压制成型，并烧结成具有一定孔隙度的钨、钼骨架，然后熔渗铜。此法适用于低铜含量的钨铜、钼铜产品。钨铜与钼铜相比，具有质量小，加工容易，线膨胀系数、导热系数及一些主要力学性能与钨铜相当等优点。虽耐热性能不及钨铜，但比目前一些耐热材料要好，因此应用前景较好。因钼铜的润湿性比钨铜的差，尤其是制备低铜含量的钼铜时，熔渗后材料的致密度偏低，导致材料的气密性、导电性、导热性满足不了要求，其应用受到限制。

Tungsten copper or molybdenum copper powder after moulding, at ********0 °liquid phase sintering. Theprepared materialuniformityis not good, there are moreclosedthe gap, the densityis usually less than *8%,butby adding a small amountof nickelactivationsintering, mechanical alloying methodfor thepreparation of ultra-fineoroxidereduction, nano powdercan improve thesintering activity, so as to improve thedensity oftungsten copper, molybdenum and copperalloy. But the nickelactivation sinteringcan makeelectrical conductivity,thermal conductivitydecreased significantly,mechanical alloyingof introducing impuritieswill also reduce thematerialconductivity; preparation ofpowder wasoxideCO-reduction, cumbersome process, the production efficiency is low, it is difficult tomass production. Tungsten, molybdenumskeleton infiltrationmethod: first thetungstenormolybdenum powderpressing, andsinteringtungsten, molybdenumskeleton with acertainporosity, andcopper infiltration. Tungsten copper, molybdenum and copperproducts,this method is suitable forlow coppercontent. Compared totungsten copperandmolybdenum and copper, with the quality ofsmall, easy processing, linear expansion coefficient, coefficient of heat conductivity andsomemain properties andtungsten copperquiteetc.. Although theheat resistancethantungsten copper, butnow someheat-resistant materialis better,andbetter application prospect. Becausemolybdenum copperwettability thantungsten copperdifference, especiallymolybdenum copperpreparation of lowcoppercontent,low densityinducedafter infiltrationmaterial, causes the material toair tightness, electrical conductivity, thermal conductivitycan not meet the requirements, its application is limited.