WDS-700 mobile phone repair software with accuracy locating for all cellphone chip repair

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What's the main features of WDS***0 mobile ic reballing machine:

Our BGA Rework Station/ BGA reballing station are widely used to replace and repair the BGA chip in laptop, mobile phone, xbox**0,ps3,etc.

The main user is repairing shops and factory to provide the after-sales service and rework.

Good Features

1). Auto soldering ,desoldering and mounting,don't need joystick control.

2). High resolution optical alignment system and HD camera system*3 axies micro adjust, accurate bga position.ensure preci-se mounting .

3). Many different sizes of nozzle, also can be customized .

4).Better system for mobile phone repairing.2 temperature zones controlled . the upper hand lower is hot air heating,can work independently.

5). With a powerful cross-flow and 1 external temp sensor socket.

6).High sensitive MCGS touch screen, Panasonic PLC control.

7). Alarm function and double over-temperature protection.

8). CE,ISO***1 approved.

What's the repair steps:

1) Separate the BGA chip from mother board we called desoldering

2) Clean Pad

3) Reballing or replace a new BGA chip directly

4) Alignment/Positioning Depend on experience ,silk frame ,optical camera

5) replace a new BGA chip - we called Soldering

 

Parameter of WDS***0 mobile ic reballing machine

More details of wds***0 mobile ic reballing machine