タイトルまたは説明

Adhesive series for chip ceramic components
Ceramic component molding adhesive materials are ceramic capacitors, ceramic inductors, ceramic buzzers, ceramic substrates, ceramic filters, ceramic sensors, ceramic microwave devices, etc.Temporary adhesive before ceramic components are sintered into porcelain.With special powder dispersant, it has ultra-thin ductility, denseness, good elasticity, small deformation, high accuracy and less sintered ash residue and other characteristics.It is used in two-step ingredients (porcelain powder, solvent, additives according to the proportion.Add it to the equipment for mixing and dispersion, and then add additives and molding agents for a second mix dispersion), used for the production of ceramic capacitors, ceramic inductors, ceramic urn filters, ceramic sensors, ceramic microwave devices, etc., ingredients for dispersible powder or thinner medium film makingprocess.