ITEM |
SPEC. |
LAYER |
10LAYER [FLEXIBLE 4L + RIGID 6L] Â 10-4-10 |
Application |
GPS |
Thickness |
1.6T |
Machine Drill |
Min. 0.2mm |
Laser Drill |
BVH Min. 0.1mm |
Cu Plating |
HOLE Min. 25㎛ |
L/S |
100㎛/100㎛ |
PSR |
GREEN |
Surface treatment |
ENEPIG, ENIG |
Impedance LAYER |
1L, 4L, 8L, 10L |
Impedance spec |
50 Ω / 100 Ω |
Description
'Rigid-Flex circuit board is the advanced
technology'
Design Capability
As printed circuit board technologies improve and electronics
continue to get smaller and smaller, you need to make sure your
current circuit board supplier has the appropriate equipment needed
for the specialty processes that are found in more advanced circuit
board designs. If your application requires a complex multi-layer
board with fine lines and traces having plug via requirements, then
we got you covered.
Our advanced multilayer Rigid-Flex circuit technology allows for
designers to sequentially add additional pairs of layers to form a
multilayer PCB up to 20 layers. JinSung Electronics has been very
specialized and is a leading company over Rigid-Flex circuit
globally, and we have supplied up to 20 layers R-Flex circuit
boards to more than 50 customers since 2015.
The Rigid-Flex circuit board is a board consisting of a rigid part
(non-bending part) and a flex part (bending part), and 3D circuit
connection is possible by flexing the flex part. In addition, it
has a bendability of up to 150,000 consecutive bends, and it is
advantageous for miniaturization and weight reduction because there
is no need for a connector for connection between
modules.
In addition, it is possible to maximize the space utilization in
the set with high design freedom, and a structural design with high
density, thinness, and various floors is also possible.
Major application fields : Smartphones, tablets, laptops,
wearables, display modules, camera modules, etc.
What core technology JinSung has for developing HDI circuit
board?
What is the HDI PCB?
HDI PCB is the Abbreviation of high-density interconnect printed
circuit board, a kind of printed circuit board manufacturing
technology. An HDI PCB is a circuit board with a relatively high
circuit density that uses micro-blind and buried "via"—or the
copper-plated holes in PCBs—technology. HDIs are compact products
designed for small-capacity users, as they cost much more than
standard PCBs.
HDI PCB boards, one of the fastest growing technologies in the PCB
industry, are now available at JinSung Electronics. HDI PCBs
contain both the blind via and buried via hole varieties and have a
higher circuitry density than traditional circuit boards.
What is the JinSung's capability to develop HDI
PCB?
A microvia maintains a laser-drilled diameter of, typically, 0.006"
(150µm), 0.005″ (125µm), or 0.004" (100µm), which are
optically aligned and require a pad diameter of typically 0.012"
(300µm), 0.010" (250µm), or 0.008" (200µm), allowing additional
routing density. Microvias can be via-in-pad, offset, staggered or
stacked, non-conductive filled and copper-plated over the top, or
solid copper filled or plated. Microvias add value when routing out
of fine-pitch ball grid arrays (BGAs) such as 0.8 mm pitch devices
and below.
Additionally, microvias add value when routing out of a 0.5 mm
pitch device where staggered microvias can be used. However,
routing micro-BGAs such as a 0.4 mm, 0.3 mm, or 0.25 mm pitch
device, requires the use of Stacked MicroVias using an inverted
pyramid routing technique.
What are HDI PCB Advantages?
1. HDI technology can reduce the cost of PCB, although when the
density of PCB increases beyond eight layers, it will be more
expensive to manufacture with HDI.
2. Have better electrical performance and signal accuracy
3. Better reliability
4. Can improve thermal properties
5. Can improve radio frequency interference/electromagnetic wave
interference/electrostatic discharge (RFI/EMI/ESD)
6. Greater design efficiency
Certifications and Patents
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