laboratory hot plate to thermally cure thin film and coating

タイトルまたは説明

CHEMAT TECHNOLOGY, INC. Has designed and manufactured a compact and easy-to-use hotplate, Model KW*4AH, for baking and curing thin films and coatings. Its rugged, portable design, and temperature uniformity make it a versatile tool for research facilities. In conjunction with KW*4A spin coater, KW*4AH hotplate can be used to fabricate metal oxide thin films, polymer coatings and metal organic thin films. 

Operation: Manual Load
Process Control: Program (For details see OMRAN operation manual)
Temperature fluctuation: ≤ ± 1°C
Temperature uniformity: ≤ ± 3%
Temperature Range:
—*0°C - **0°C (KW*4AH***0)
—*0°C - **0°C (KW*4AH***0)
Substrate Size:
—7.5 inch X 7.5 inch(KW*4AH***0)
—5.8 inch X 5.8 inch(KW*4AH***0)
Inert gas purge (KW*4AH***0 only)