fpc/ flexible printed circuit board

Description

FPC Parameter Max size: **0mm X **0mm Surface finish: Sn/ Pb Plating, Chemical Immersion Sn, Gold Planting, Chemical Immersion Gold; Technological Capacity: Min line: 2mil Min space: 2mil Min hole: ï¿ 0.1mm Dimension Tolerance: General Dimension: ï&frac*4;‹/*0.1mm Special Dimension: ï&frac*4;‹/*0.*5mm POLYIMIDE(PI) Solder Heat Resistance: >**8℃/*0” Peeling Strength: >1.2kgf/cm Surface Resistance: >1.0 X ***1Ω Volume Resistance: >1.0 X ***5Ω Insulation Resistance: >1.0 X ***1Ω Polyimide: 0.***5 , 0.**5 , 0.**5 , 0.**0mm Copper (RA&ED): 0.**2 , 0.**8 , 0.**5 , 0.**0 , 0.**0mm POLYESTER(PET) Solder Heat Resistance: >**0℃/*0” Peeling Strength: >1.2kgf/cm Surface Resistance: >1.0 X ***1Ω Volume Resistance: >1.0 X ***5Ω Insulation Resistance: >1.0 X ***1Ω PET: 0.***5 , 0.**5 , 0.**5 , 0.**0mm Copper (ED): 0.**2 , 0.**8 , 0.**5 , 0.**0 , 0.**0mm