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連絡先担当者 Mr. David
Wenjing, Nanjing, Jiangsu
Features in; 1. Series or parallel the igh efficient crystal silicon chips 2. Adop advanced lead-free welding and no-clear solder. 3. Glue Connection>*0% 4. Automatic lamination technology, and hot-pressing sealed by high transmittance and low iron toughened glass, anti-aging EVA and excellent fire resistance of TPT. 5. Thicker hollow and aluminum frames packaging. 6. Connecting box has TUV approval.
