double-sided pcb

Description

Detailed Product Description Double-sided PCB&#**9;S/Gold finger board 1) Layer: double-sided 2) Board finished thickness: 1.6mm 3) Material: FR*4 4) Min. drilled hole size: 0.*5mm 5) Min. Line width: 3mil (0.**5mm) 6) Min.Line spacing: 3mil (0.**5mm) 7) Surface finish/treatment: immersion gold 8) Copper thickness: 1 OZ *0) Solder mask color: green *1)Inner packing: Vacuum packing / Plastic bag Outer packing: Standard carton packing *2) Sample or mass produce, 6 to *8 days lead time Reference - Our Production Capability for Multilayer PCB/Rigid borad Item M- Layer count ***0 layers Material FR4(High TG, Halogen Free, high frequency), CEM1, CEM3, BT, Al base mateiral, and so on. Supplier: SY, KB, ITEQ, Isola, Nelco, Rogers, Grance, Mitsui Maxpanel size *2±*0(**0mm±**8mm) Min width/space(min) 4mil/4mil Max copper weight **0um(4oz) for inner layer **5um(5oz) for outer layer Min machine drill size 0.2mm(8mil) Via hole tpye Blind/Burried/plugged Thickness of finished board 0.***6.0mm Tolerance Registration of innerlayer to of innerlayer:±3mil Accuracy of hole position:±2mil Tolerance of dilled slot:±3mil Tolerance of PTH diameter:±3mil Tolerance of NPTH diameter:±2mil PTH hole copper thichness: 0.**2mil Image to image tolerance:±3mil Tolerance of etching:±1mil Solder mask registration tolerance: ±2mil Finished board : Thickness<=1.0mm: +/*0.1mm Thickness>0.1mm:+/**0% Outline router: +/*0.1mm Outline Score: +/*0.2mm Color of solder mask Green, Black, Blue, Red, White and so on Surface freatment HASL, HASL Lead Free, OSP , Immersion Gold, Immersion Ti, Immersion Sliver, Flash gold, Selective Gold plating(gold thicness up to **0u), Gold figers , Carbon print, Peelabe Mask Hardness of solder solder >=6H Outline finished CNC, V-CUT, Punching Peel strength of line ≥*1B/in Warp and twist ≤0.7%