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Blind via pcb

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BICHENG ENTERPRISE LIMITED

BICHENG ENTERPRISE LIMITED

China

無料会員

連絡先担当者 Mr. Kevin

3-203, Shidai Jingyuan, fuyong,baoan, Shenzhen, Guangdong

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Description


1). 1+C*1 HDI, buried/blind L*-L5/L*-L8 vias.
2). FR*4 Material, 1 oz weight.
3). 8 layer, 1.6mm thick.
4). 4/4 mils track and space
5). Min.drill 0.1mm
6). Green solder mask/ white silkscreen
7). Immersion gold over nickel

1). 1+C*1 HDI, buried/blind L*-L5/L*-L8 vias.
2). FR*4 Material, 1 oz weight.
3). 8 layer, 1.6mm thick.
4). 4/4 mils track and space
5). Min.drill 0.1mm
6). Green solder mask/ white silkscreen
7). Immersion gold over nickel

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Mr. Kevin < BICHENG ENTERPRISE LIMITED >

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