Sell CMP POLISHING SLURRY

Description

GRISH Chemical Mechanical Polishing (CMP) Slurries are colloidal silica liquid made of high purity de-ionized water, highly engineered chemical additives and abrasives that chemically and mechanically interact with work piece surface to remove excess materials, therefore smooth or flatten the surface. They are widely used for nanometer scale chemical mechanical polishing fields such as silicon wafers, compound crystals, optical apparatus, and sapphire polishing. The slurries have a wide range of diameter from *0 to **0 nm to meet different requirements. There are alkaline and acidic slurries based on the pH. GRISH CMP slurries are developed under the concepts of high purity, high removal rate, high dispersion and scratch-free performance. GRISH supplies CMP polishing slurry to customers around the world and is the most competitive in quality and price. Featuresï&frac*4;š ● High speed polish: with large particle of colloidal silica (Grit size up to **0 nm) ● Controllable size: a wide range of custom-graded colloidal silica slurries from *0 to **0 nm that suits individual needs and applications ● High purity: the content of Cu2+ï&frac*4;œ*0 ppb, without contamination on the work piece ● Super-smooth polishing: with the particle of SiO2, avoid scratch on the object surface Typical Properties Alkaline Type pH: 9.8±0.5 SOQ*2 SOQ*4 SOQ*6 SOQ*8 SOQ**0 SOQ**2 Acidic Type pH: 2.8±0.5 ASOQ*2 ASOQ*4 ASOQ*6 ASOQ*8 ASOQ**0 ASOQ**2 Grit Size(nm) *0~*0 *0~*0 *0~*0 *0~*0 *0~**0 **0~**0 Appearance Milk white or semitransparent liquid Density (g/ml) 1. *5±0.*5 Component Contentï&frac*4;ˆwt%ï&frac*4;‰ SiO2 *5ï&frac*2;ž*0 Na2O ≤0.3 Heavy metal impurity ≤*0 ppb Silica Wafer Polishing Reference Data Polishing Pressure **0 ï&frac*2;ž **0 g/cm2 Polishing Temperature *2 ~ *0 °C (*9 ~ **4 °F) Dilution 1:1 - *0 Polishing duration 3 ~ 6 minutes Packaging: **0 ml/bottle, *5 kg or **0 kg/barrel. Customizations are available upon requests. Storage: Keep the stored t