Pcb Solder Pallet Materials are glass fibre composite specifically
designed to meet the various challenges of the PCB assembly
process. It is suitable to wave soldering and SMT
process. It can be machined to the
tolerances required for accurate and retains its flatness through
continuedcycling in reflow
oven.-- The low thermal conductivity of the materials
prevents heat sinking from PCB, ensuring
adequatereflow of the solder
paste. Application:- It can be used in following
applications in SMT aseembly process.- Solder paste printing- SMT placement- Reflow-- Wave soldering
process
