slide type dip switch

Description

DSDADP type DIP switch MECHANICAL ***** Force: **0g Max 2.Stroke: 2.*0mm ***** temp: **0degree~*0degree 4.Storage Temp: **0degree to *5degree MATERIALS 1.BASE: Engineering plastics, Black. *****: Engineering plastics, Red or Blue. 3.BUTTON: Engineering plastics, White. *****: Alloy copper, Gold plating. ELECTRICAL ***** Life: ***0 operations cycles per switch. *****-Switching Rating: **0mA, *0VDC 3.Switching Rating: *5mA, *4VDC ***** Resistance: *0m Max, at initial;**0m Max, after life test. ***** Resistance: **0m, **0VDC 6.Dielectric Serength: **0VCD/1 minute *****: 5pF Max. *****:Single pole single throw. SOLDERING AND CLEANING PROCESSES 1.Keep all switch contacts in their "OFF" position for all operation . 2.Wave Soldering: Recommended Solder Temperature at **0degree Max.5 seconds . 3.Hand Soldering: Use a soldering iron of *0 watts, controlled at **0degree approximately 2 seconds, while applying solder. ***** Process: Flux clean using force rinse, high agitation or triple bath cleaning mathod. Freon TF or TE give excellent results.When vapor methods are used do not subject the switch to solvents at temperature above *1degree. PACKING All DIP switches are packed in standard IC tube. SMT type can be packed in Tape or Reel packing