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Battery Charging Equipment PCB Assembly Process- Grande PCBA

Battery Charging Equipment PCB Assembly Process- Grande PCBA

FOB Price

Get Latest Price

15 / Piece ( Negotiable )

|

Minimum Order

Place of Origin:

-

Price for Minimum Order:

Minimum Order Quantity:

1 Piece

Packaging Detail:

bubble bag and regular carton

Delivery Time:

3 weeks

Supplying Ability:

300000 Piece per Month

Payment Type:

D/P, D/A, L/C, T/T

今すぐお問い合わせください
無料会員

連絡先担当者 Ms. Eileen

No45 Room A510-512, Automobile Mansion, No.45 Zhenhua Road, Futian District, Shenzhen, Guangdong

今すぐお問い合わせください

Description

Supplier: Shenzhen Grande Electronics
Layers: 4
Application: Battery Charging Equipment PCB Assembly Process- Grande PCBA
PCB:FR*4/1.6mm, 1oz finished copper
Surface Treatment: HASL
PCBA Lead time: **4 weeks
Packing: Anti-static bag and compartmental packing
Standard Warp:

[Description]
1, Turnkey solution for Battery Charging Equipment PCB Assembly Process- Grande PCBA.
2, PCB Assembly, PCB fabrication / PCB layout, PCB re-layout.
3, Electronic Contract Manufacturing.
4, SMT&DIP&PTH&BGA.
5, Components Sourcing.
6, Quick PCBA prototype.
7, X-ray test, the Internal Circuit Test (ICT) , Functional Test (FCT)
8, Sample and small batch order are accepted.


PCBA Service
Customer offers: Gerber file, PCB Specification, BOM and Assembly Drawing.
Full-turnkey PCBA: ***0Layers PCB, Components Sourcing, SMT, PCBA testing, PCBA Aging test, PCBA Packing and PCBA Shipping.

PCBA Quality Assurance
1, Certifications: UL, SGS, TUV, BV, ROHS, ISO***1: ***8, TS****9: ***8
2, 7 lines dust-proof SMT lines and DIP lines.
3, All line works wear anti-static and dust-proof clothing.
4, All operators should pass strictly training before they start work.
5, SMT Equipment:solder paste printer in Jidakang,, Mounter in Panasonic, Re-flow, Wave Soldering, Semi-auto DIP
6, PCBA Test Equipment: ORT, Constant temperature and humidity chamber,3D CMM,X-Ray.
7, PCBA Test:ICT, Functional Circuit Test and X-ray test.
8, Package Processed:
***2, ***3, ***5, ***6, ***8, ***5, ***6
Micro QFP 0.2mm
Flip-chip, BGA, Connectors
BGA Ball Pitch=0.2mm
9, Each workstation in accordance with the SOP
*0, Materials:FR*4, FPC, Aluminum,High TG,Halogen-Free, HF, CEM*1, CEM*3, FR*1, **-V0 and so on.
*1, Material Brand:KB, SHENGYI, NANYA and so on.

PCBA Lead Time
PCBA prototype: ***0 working days after contract signed and EQ confirmed.
Mass production: partial delivery according to the customers requirement.
 

Send a direct inquiry to this supplier

To:

Ms. Eileen < Shenzhen Grande Electronics Co., Ltd >

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