Description

PCB technical capacity Base materials: high temperature FR4/FR5, free halogen FR4, aluminium based, polyamide, rogers, arlon, other teflon/PTFE Layers: 1 to *0 layers standard PCB, blind Vias and buried Vias board Minimum track space: 4mil/4mil, 3mils partial allowed Maximum size: 1, **0 x 1, **0mm Minimum size: 3 x 3mm Surface copper thickness: Maximum: 6/*-ounce Minimum: 0.5/0.*-ounce Hard gold thickness: maximum: *0Î&frac*4; inches Maximum board thickness: 6.0mm Finishes: SMOBC/HASL, lead-free SMOBC/HASL, organic OSP, hard and soft gold, plating tin, immersion silver, immersion tin, electroless nickel/immersion gold