we can manufacture the 3inch sappire polising wafer
dia 3 inch
orientation C(***1)/A(***0)/M(***0)/R(***2)
suface: polishing/etching polishing/polishing
thickness: **0um **0um customization
Flat Length *6mm
TTV < 5um
TIR < 2um
Bow < *0um
packing:Vacuum-sealed containers with nitrogen backfill in a class
**0 environment.
Roughness: < 0.2nm
