Description

Sil-Pad thermally conductive insulators, in their many forms, continue to be a clean and efficient alternative to mica, ceramics or grease for a wide range of electronic applications. Sil-Pad provides Excellent thermal performance Eliminates the mess of grease More durable than mica Efficient " total applied cost " that compares favorably with other alternatives. Detailed Description The AP series of thermal conductive Silicon pad has high thermal conductivity, soft , high superficial bonding, high compression ratio, high rebound resilience characteristics and so on. May choose the fiberglass, craft thickness vary from 0.5 to 5 mm , the finished goods thickness **0**5mm, may also design other colors and the specification size according to the customer requirements. The very thin heat conduction tack coat brings the very low thermal resistance, Specially developed and manufactured for designs which using gap to transfer heat, it can fill the gap, completes heat transferring between heating part and cooling device. Meanwhile, it also plays roles on absorption of shock, insulation, sealing etc. It can meet the design requirements of equipment miniaturization and being ultrathin, has extremely manufacturability and practicability, conforms to the RoHS requirements and other related environmental protection requirements. Technical characteristic This product mainly applicated in high power supply, liquid crystal computer power source adapter, LED display screen; high-power decorative lighting, road lamp, computer CPU/motherboard/graphics card/memory bank, and vary kind of computer controller, the monitoring device, electric car controller and all high power need to heat dissipation and insulation. Use method Clean and dry the issue surface, take off both-side polyester film of the product, then stick it. Packing and Storage Packing paper box package; its innocuity and flame-resistant issue, and can be moving, transporting