FOB Price
Get Latest Price|
Minimum Order
Place of Origin:
-
Price for Minimum Order:
-
Minimum Order Quantity:
-
Packaging Detail:
-
Delivery Time:
-
Supplying Ability:
-
Payment Type:
-
連絡先担当者 Ms. He
Fuyong, Shenzhen, Guangdong
COG Bonding M/C
Application:
The machine is used for bonding IC driver onto various LCD
glasses.
Key Feature:
a. The upper and lower constant temperature heat structure of
the equipment makes up defective technics of the only upper
constant temperature heat structure during production.
b. Japanese precise linear slide rail of bond head suitable
to high precision bonding technics.
c. Korean precise cylinder of bond head greatly reduce the
defect of product because of self-gravity.
d. Adjustable LCD table meet to the requirement of
diversified productions.
Â
