Metal Bond Diamond Powder/MBD

Description

Metal Bond Diamond Powder is produced from high quality diamond saw grits. With well-controlled size, shape and transparency, the product is specifically designed for metal bond system. Key Features: 1. Monocrystalline structure 2. Blocky structure for strength 3. Extremely close grade achieved from high particle strength 4. Superior bond retention 5. Enhanced cutting edges and faster material removal rates. Ideal for critical lapping and finishing applications on metallics and most nonmetallics 6. Grinding wheels, general lapping, PCD Economy grade meets most size, shape and surface requirements. Good general purpose product designed to provide acceptable surface finish and material removal results in all applications where tight tolerance is not required. Available Grit Size: **0.5 **1 0.**1 0.**1.5 **2 **2 1.**3 **4 2.**5 **6 **8 ***0 ***2 ***2 ***6 ****0 ****2 ****0 ****6 ****4 Premium grade shows the most tightly controlled size, shape and surface properties. Superior product derived from synthesised monocrystalline diamond which has excellent impact resistance. Highly recommended for processing Si wafer, slicing and dicing applications as well as lapping of glass and ceramics. Available Grit Size: **0.5 **1 0.**1 0.**1.5 **2 **2 1.**3 **4 2.**5 **6 **8 ***0 ***2 ***2 ***6 ****0 ****2 ****0 ****6 ****4 Other sizes upon request.