Description
1．Layers： ***0 layers
2．Max. Board size：***0×**0mm
3．Min. board
Thickness： *-layer 0.*5mm
*-layer 0.*8mm
*-layer 0.*5mm
*-layer 0.*0mm
**-layer 1.0mm
4．Min. line
Width/Space：0.**5mm(3mil)
5．Max. Copper
thickness：6OZ
6．Min. S/M Pitch：0.**5mm(3mil)
7．Min. hole size：0.1mm(4mil)
8．Hole dia. Tolerance
(PTH)：±0.*5mm(2mil)
9．Hole dia. Tolerance
(NPTH)：
*0/*0.*5mm(2mil)
*0．Hole position
deviation：±0.*5mm(2mil)
*1．Outline
tolerance：±0.*0mm(4mil)
*2．Twist & Bent：0.*5%
*3．Insulation
Resistance：>***2 &branded;
Normal
*4．Electric
strength：>1.3kv/mm
*5．S/M abrasion：>6H
*6．Thermal stress：**8°C *0Sec
*7．Test Voltage：*****0V
*8．Min. blind/buried
via：0.*5mm (6mil)
*9．Surface Finished：HAL, ENIG, ImAg, Imsn OSP, Plating
AG, Plating gold
*0．Material：FR4,H-TG,Teflon,Rogers,Ceramics,Aluminium,
Copper base
