Description
Introduction
Design According
To：
* CPCI Specification PICMG 2.0
R3.0
(October 1,
***9)
* CPCI Hot Swap Specification PICMG
2.1 R1.0 (August 3, ***8)
* CPCI System Management
Specification PICMG 2.9 R1.0 (February 2, ***0)
* Keying of CPCI Boards and Backplanes
PICMG 2.*0 R1.0 (October 1, ***9)
* CPCI Power Interface Specification
PICMG 2.*1 R1.0 (October 1, ***9)
* PCI-PCI Bridging for Compact PCI
Backplanes PICMG 2.6
Main Features
* *4 slots: 1 x System slot + *3 x
Peripheral slot +
1 x Bridge
* *3MHz/*2bit, real
I/Oavailable
* PCB Type: *0
layers
* Power Connector: ATX power
receptacle or others
* Maximum Voltage Drop On
Backplane Power: < *0mV
* V(I/O): *3.3V /
*5VSelectable
* Impedance: *5±*0% ohm for
trace
* Operating Temperature: 0°C ~
**0°CDescription
* Storage Temperature: **0°C ~
**5°C
* MTBF: **0,**0 Hrs
