Sell IC Lead Frame

Description

Product Material：

Materials maximum effective size: **0mmX***0mm

Material thicknes: 0.*5mm~1.2mm

Processing materials:

Stainless steel series , For example： SUS**1 SUS**2 SUS**3 SUS**4 SUS**6 SUS**0 Etc.

Copper and copper alloy series: Copper、Brass、Bronze、 Copper-nickel alloy、C**4 Copper (Lead frame materials used). Aluminum and aluminum alloy series, For example：1A**1A******1A*0 Etc.

Nickel and nickel alloy series: Pure Nickel、E-nickel alloy、 Nickel-manganese alloy
For example：YEF***4J**4J**9 Etc.

Product precision：

Material thickness/Item：0.*5mm~0.*0mm，Minimum aperture：1.3X Material thickness，The smallest
diameter：Less than Material thickness，General Tolerance：±0.**5~0.**5mm.

Material thickness/Item：0.*0mm~0.*0mm，Minimum aperture：1.2X Material thickness，The smallest
diameter：to be equal to Material thickness，General Tolerance：±0.**5~0.*5mm.

Material thickness/Item：0.*0mm~1.2mm，Minimum aperture：1.1X Material thickness，The smallest
diameter：1.1X Material thickness，General Tolerance：±0.*5~0.*0mm.