Sell Semiconductor test wafers

Description

Wafers are formed of highly pure (*9.***9% purity),[1] nearly defect-free single crystalline material.[2] One process for forming crystalline wafers is known as Czochralski growth invented by the Polish chemist Jan Czochralski. In this process, a cylindrical ingot of high purity monocrystalline silicon is formed by pulling a seed crystal from a 'melt'.[3][4] Dopant impurity atoms such as boron or phosphorus can be added to the molten intrinsic silicon in precise amounts in order to dope the silicon, thus changing it into n-type or p-type extrinsic silicon.

The ingot is then sliced with a wafer saw (wire saw) and polished to form wafers.[5] The size of wafers for photovoltaics is **0–**0 mm square and the thickness is **0–**0 μm. In the future, **0 μm will be the standard.[6] Electronics use wafer sizes from **0–**0 mm diameter. (The largest wafer made has a diameter of **0 mm but is not in production yet.)