Description
Item
Capabilities
Number of Layers
Double Side
Material
FR*4,CEM*3,HighTg, Aluminum,
Halogen Free
PCB Thickness
Min.thickness
0.2mm(8mil)
Max.thickness
3.2mm(**8mil)
Surface finished
Gold Plating
Immersion Gold(Silver)
HAL Lead Free
Hot Air Solder Leveling(HASL)
Entek Coating (OSP)
Solder Mask
Green,White,Black,Yellow,Red,Blue
Other printing
Gold Finger
Carbon Print, Peelable Mask
Solder Mask Plugged Hole
Copper thickness
1/ 2 oz (*8 μm) - 4 oz (**0 μm)
Min. Finished Hole Size
0.3mm(*2mil)
Hole Size Tolerance (PTH)
+/ *0.**6mm (3 mil)
Hole Size Tolerance (NPTH)
+/*0.*5mm (2 mil)
Min. Line Width and Spacing
0.*0mm (4 mil)
Min. Solder Mask Clearance
0.**6mm (3 mil)
Min. Annular Ring
0.1mm (4mil)
Profile and V-Cut
CNC-Routing, Stamping and Beveling,V-CUT,CNC
Special Process
Micro-section, Chamfer for Gold Finger
