Description
Bench top reflow oven, lead free solder, SMT assembly, PCB
prototype production, ***1 Resistance, capacitance, Diode,
Transistor, fine pitch QFP,SOP,PLCC,BGA,CSP and others can be
solder;
1 It can finish solder in stationary status, min pitch SMD
components can be mounted;
2. Infrared and strong hot air cycle heat in solder area; 3.
Dynamic tracking temperature, LCD shows changing temperature
curve;
4. It is with PC communication connector, temperature curves can be
saved in the machine by the software;
5. Working size **0×**0（mm） 6. Dimension
**0×**0×**0（mm）
7 power supply：**0VAC 8. Power consumption: 3.5kw
9. Temperature range: 0℃****0℃ lead free solder
process（QFP/FPC/BGA）
*0. Temperature accuracy：±1℃ *1. Temperature
uniformity
：±3
