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|Minimum Order
Place of Origin:
China
Price for Minimum Order:
-
Minimum Order Quantity:
10 Piece
Packaging Detail:
Each with vacuum bag, 20 pieces in a paper box and then packed in cartons
Delivery Time:
10-30 days after order
Supplying Ability:
500 Piece per Week
Payment Type:
T/T, L/C
連絡先担当者 Amanda
No.222 Weiqi Road Yueqing Economic Development Zone, Wenzhou, Zhejiang
Copper bonding wire is a kind of material for inner lead with excellent electrical, thermal, mechanical properties and excellent chemical stability, mainly for key materials of semiconductor packaging( molding compound, solder ball, high-desity packaging substrate, conducting resin).
Features of products:
1. material costs: low
2. electronical conductivity: 5.*8 *0E7/Ohm
3. thermal conductivity: *9.5KW/m2k
4. mechanical properties: good
5. stability: stable
6. solder joint: relatively better
Diameter(mm)
| 0.**8 | 0.**0 | 0.**3 | 0.**5 | 0.**8 | 0.**0 | 0.**2 | 0.**3 | 0.**8 | 0.**0 |
special order avaliable
Copper Wire Physical Properties:
|
Resistivity |
1.**0**0*6 Ω.cm |
|
Density |
8.9g/cm3 |
|
Purity |
5N |
|
Pull(Φ*5μm) |
>7cN |
|
Arc height |
8mil |
|
Fusing current |
Same as usual copper bonding wire |
Copper Bonding Wire Advantage:
1. Material costs: Low
2. Conductivity: 5.*8 *0 E7/Ohm Much thinner bonding wires during fine pitch packaging,
excellent performance of fine pitch(much smaller bonding pad), improving
current capacity and property of power regulating device.
3. Thermal conductivity: *9.5 KW/m2K
4. Mechanical properties: High mechanical property, larger tensile strength, better elongation,
excellent ball collar strength and higher arc stability.
5. Stability: Stable-slow inter-metallic growth rate, improving mechanical stability
and decreasing incremental resistance: moderate IMC growth enables
bonding strength to be improved.
6. Solder joint: Significantly reduced inter-metallic growth rate of solder joints. Resistance
reduced, heat production decreased, bonding reliability and device performance
improved. As the new products have their inter-metallic growth rate, resistance
and heat production lower than gold wire, the amount of resistance increase with
time and aging rete also is reduced.
