Description

Specification:
High Purity Tin:
Sn**5 Grade *9.**9. The content of Tin is above *9.**9%. The total content of AG, Al, As, Au, Bi, Ca, Co, Cu, Fe, In, Mg, Ni & Pb is bellow *0 ppm;
Uitra Purity Tin:
Sn**6 Grade *9.***9. The content of Tin is above *9.***9%. The total content of AG, Al, Au, Ca, Co, Cu, Fe, Mg Ni & Zn is bellow 1 ppm.

Usage:
It is mainly used in the manufacture of compound semiconductor, High purity alloy, superconducting material, Solder and as a dopant of compound semiconductor.