Description
1.OEM service
2.Factory price
3.Certificate:UL,ISO,TS****9,Rohs ;
4.Paypal, T/T,West Union
5.MOQ:1pcs
Our capacity:
- Layer: 1 to *8 layers
- Material type: FR*4, CEM*1, CEM*3, High TG, FR4 Halogen Free,
Rogers
- Board thickness: 0.*1mm to 7.0mm
- Copper thickness: 0.5 OZ to 7.0 OZ
- Copper thickness in hole: >*5.0 um (>1mil)
- Size:
- Max. Board Size: *3 × *5 (**0mm×**0mm)
- Min. Drilled Hole Size: 3mil (0.**5mm)
- Min. Line Width: 3mil (0.**5mm)
- Min. Line Spacing: 3mil (0.**5mm)
- Surface finishing: HASL / HASL lead free, HAL, Chemical tin,
Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
- Solder Mask Color: Green/Yellow/Black/White/Red/Blue
- Tolerance
- Shape tolerance: ±0.*3
- Hole tolerance: PTH: ±0.**6 NPTH: ±0.*5
- Inner packing: Vacuum packing / Plastic bag
- Outer packing: Standard carton packing
- Certificate: UL, ISO ***1, ISO ****1
- Special requirements: Buried and blind vias+controlled
impedance +BGA
- Profiling: Punching, Routing, V-CUT, Beveling
- Provides OEM services to all sorts of printed circuit board
assembly as well as electronic encased products.
- Layer: 1 to *8 layers
- Material type: FR*4, CEM*1, CEM*3, High TG, FR4 Halogen Free,
Rogers
- Board thickness: 0.*1mm to 7.0mm
- Copper thickness: 0.5 OZ to 7.0 OZ
- Copper thickness in hole: >*5.0 um (>1mil)
- Size:
- Max. Board Size: *3 × *5 (**0mm×**0mm)
- Min. Drilled Hole Size: 3mil (0.**5mm)
- Min. Line Width: 3mil (0.**5mm)
- Min. Line Spacing: 3mil (0.**5mm)
- Surface finishing: HASL / HASL lead free, HAL, Chemical tin,
Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
- Solder Mask Color: Green/Yellow/Black/White/Red/Blue
- Tolerance
- Shape tolerance: ±0.*3
- Hole tolerance: PTH: ±0.**6 NPTH: ±0.*5
- Inner packing: Vacuum packing / Plastic bag
- Outer packing: Standard carton packing
- Certificate: UL, ISO ***1, ISO ****1
- Special requirements: Buried and blind vias+controlled
impedance +BGA
- Profiling: Punching, Routing, V-CUT, Beveling
- Provides OEM services to all sorts of printed circuit board
assembly as well as electronic encased products.
- Layer: 1 to *8 layers
- Material type: FR*4, CEM*1, CEM*3, High TG, FR4 Halogen Free,
Rogers
- Board thickness: 0.*1mm to 7.0mm
- Copper thickness: 0.5 OZ to 7.0 OZ
- Copper thickness in hole: >*5.0 um (>1mil)
- Size:
- Max. Board Size: *3 × *5 (**0mm×**0mm)
- Min. Drilled Hole Size: 3mil (0.**5mm)
- Min. Line Width: 3mil (0.**5mm)
- Min. Line Spacing: 3mil (0.**5mm)
- Surface finishing: HASL / HASL lead free, HAL, Chemical tin,
Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
- Solder Mask Color: Green/Yellow/Black/White/Red/Blue
- Tolerance
- Shape tolerance: ±0.*3
- Hole tolerance: PTH: ±0.**6 NPTH: ±0.*5
- Inner packing: Vacuum packing / Plastic bag
- Outer packing: Standard carton packing
- Certificate: UL, ISO ***1, ISO ****1
- Special requirements: Buried and blind vias+controlled
impedance +BGA
- Profiling: Punching, Routing, V-CUT, Beveling
- Provides OEM services to all sorts of printed circuit board
assembly as well as electronic encased products.
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