Description

Completely self-developed MEMS Hot-film silicon chip featured with compactness, high accuracy, short response time & reverse flow detection
Our unique design air intakes featured with more stable intake air flow and more accurate measurement
Intelligent signal processing circuit;PCB design;All the devices is mounted by SMT with reliable performance.
Aluminium wire bonding, advanced automatic aluminium wire bonding equipment, featured with reliable performance and good uniformity.
Gel casting technology make the circuit component be protected against moisture, shock, which offers greater reliability.
Encapsulation materials is made of PBTGF*0, featured with following advantages:high mechanical strength;resistance to press;high heat resistance.