Description
Contactless IC Module Picking-placing
Machine YPP****0�
Feature
Description
This machine is
designed for precisely placing the single contactless IC chip onto
chip fixing holes in the INLAY sheet. In order to ensure chip
fixing precision, the IC chips are picked and placed with vacuum
after air cylinder holds the PVC sheet to ensure its
flatness.
Photoelectric
sensor is applied to monitor and control the chip feeding. If
failure or mistake occurs, it will give warning and stop the
machine.
�
High-precise
dual-axles are used to pick, move and place the chips with PLC
controlled in order to ensure high position
precision.�
�
Picking or
placing location for each module can be individually adjusted to
ensure high precision of positioning.��
�
It is designed to
have two picking-placing units and two working tables to ensure
high efficiency.�
�
The liquid glue
injection unit is available in the latest design.
�
It is controlled
by Mitsubishi PLC with big-size colorful man-machine interface
display.�All the pneumatic parts are made by
SMC.��
�
�
Different sheet
layout (such as 3�8/4�8/5�5) can be proceeded on the same
machine.
�
Technical
Parameters
�
1.�������Speed:
********0 pcs per hour.
�
2.�������Dimension:
L***0�W**0�H***0mm
�
3.�������Weight:
**0 KG �����
�
4.�������Power
supply: AC**0V *0/*0HZ
�
5.�������Power:
3KW
�
6.�������Compressed
air: 6 kg/cm2
�
7.�������Air
Consumption: *0 L/min.
�
8.�������Control
mode: PLC+ dual-axis location system
�
9.�������Chip
positioning precision: �0.*5mm
�
Note:��
�
For more
information, please download the below PDF
file.
���
For more
information, please visit our official
website.
