Description

Introduction

    By employing new technologies and imported facilities, YW-YB series electroplated bond blade with hub is our company’s high level product. A combination of an ultra –thin diamond blade and a aluminum hub provides enhanced operation efficiency and stable cutting result ,by adjusting blade strengthens rigidity and prevents slant or wavy cutting ,avoid blade’s broken.

 Features

1.High strength ,high accuracy ,ultra-thin ,long life and easy to operation

2.Bevel and step cutting

3.Shorter blade change time –increased productivity .

4.Wide range of grit sizes and bond types to support various application requirements.

How to choose the hard blades?

       1.Bond: very soft, soft, hard, very hard, special

       2.OD and ID

       3.Grit size

       4.Concentration

       5.Exposure

       6.Kerf width

    Above six elements is the main considerations for choosing hard blades. The specific details rely on the usage, request and working conditions.
 

Applications:

      1.Semiconductor discrete devices: GPP, MOSFET, SKY, Diode

       2.Integrated circuit: BGA, QFN, PCB, Epoxy, Alloy framework plastic board, Composite plate with sandwich

3.Semiconductor Chemical compund: Gallium arsenide ,Gallium phosphide,Gallium arsenide phosphide,etc.

       4.Silicon Wafer Die

       5.Others: LTCC/HTCC, Image sensor