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Metal Bond Diamond Dicing Blades for PCB, IC, BGA

Metal Bond Diamond Dicing Blades for PCB, IC, BGA

FOB Price

Get Latest Price

1 ~ 100 / Piece ( Negotiable )

|

Minimum Order

Place of Origin:

-

Price for Minimum Order:

Minimum Order Quantity:

1 Piece

Packaging Detail:

customized

Delivery Time:

3-5 days

Supplying Ability:

1000000 Piece per Week

Payment Type:

T/T, L/C, D/A, D/P, Western Union, Money Gram, PayPal

今すぐお問い合わせください
無料会員

連絡先担当者 chenkai

HangHai Road, ZhengZhou , China, Zhengzhou, Henan

今すぐお問い合わせください

Description

Features

Wear resistance between nickel and resin blade

Strong abrasive and high wear resistance, suitable for the precision materials

Average the particle size distribution, reduce inclined cutting and wave cutting effectively.

Precise control of the concentration is suitable for the application of multiple materials.

Blade with slot can effectively improve the cutting quality and blade life.

      

Application

    Electronic device, ceramic substrate, optical glass, optical device(lens, window and substrate), semiconductor packing device, SMD L ED PCB, LED ceramic substrate, etc.

Send a direct inquiry to this supplier

To:

chenkai < Henan Yinwang Trade Co. , Ltd >

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