Description

Our main products are polyimide(PI) film based 3 layers Flexible Copper Clad Laminate(3L-FCCL),also known as Copper Clad Laminate with adhesive.

Product Specifications：
Base Film: PI (Polyimide) film
Thickness of PI: 0.5/1mil (*2.5/*5um)
Thickness of copper foil: *2um**5um
Construction: Single/Double-sided
 
Features：
* Halogen-free 
* Excellent dip soldering resistance
* High bond and peel strength
* Good chemical resistance
* Good dimensional stability
* Excellent dielectric properties
* Good flammability and UL*4 V*0
 
 Application: FPC of Digital Products, Computers, laptop, Mobile Phone, printer, Aviation and Aerospace, automotive Fields, etc;