Pcb Solder Pallet
Materials are glass fibre composite specifically designed to meet
the various challenges of the PCB assembly process. It is suitable
to wave soldering and SMT process. It can be machined to the
tolerances required for accurate and retains its flatness through
continuedcycling in reflow
oven.-- The
low thermal conductivity of the materials prevents heat sinking
from PCB, ensuring adequatereflow of the solder paste. Application:- It can be used in following applications in
SMT aseembly process.-
Solder paste printing- SMT
placement- Reflow--
Wave soldering process
