Description
Materials: FR4 laminate
PCB thickness: 1.6mm+/**0%
Final copper: 1oz
Min hole: 0.2mm
Min line width/space: ≥*0mil
Soldermask: Green
Surface: immersion silver
Outline: Rout & complex outline
HIGH ETMaterials: FR4 laminate
PCB thickness: 1.6mm+/**0%
Final copper: 1oz
Min hole: 0.2mm
Min line width/space: ≥*0mil
Soldermask: Green
Surface: immersion silver
Outline: Rout & complex outline
HIGH ETMaterials: FR4 laminate
PCB thickness: 1.6mm+/**0%
Final copper: 1oz
Min hole: 0.2mm
Min line width/space: ≥*0mil
Soldermask: Green
Surface: immersion silver
Outline: Rout & complex outline
HIGH ET
