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Latest private mold universal one drag two Secure Fit design Q10 sports Bluetooth earphone

Latest private mold universal one drag two Secure Fit design Q10 sports Bluetooth earphone

FOB Price

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7.98 ~ 8.35 / Piece ( Negotiable )

|

Minimum Order

Place of Origin:

-

Price for Minimum Order:

Minimum Order Quantity:

500 Piece

Packaging Detail:

100 sets into one carton

Delivery Time:

sample will be delivered within 3 working days, fo

Supplying Ability:

6000 Piece per Day

Payment Type:

T/T, L/C, Western Union, PayPal

今すぐお問い合わせください
無料会員

連絡先担当者 Ms. Jackie

3F, No.99 Building, Tongfucun Industrial Area, Dalang North Road, Longhua New Area, Shenzhen, Guangdong

今すぐお問い合わせください

Description

Latest private mold universal one drag two Secure Fit design Q*0 sports Bluetooth earphone (universal bluetooth headset, sports bluetooth headphone,private mold earphone bluetooth)

Specification:

1    Model                       Q*0

2    Bluetooth version    V4.1+EDR

3    Profiles supported    HFP, HSP,AVRCP

4    Battery capacity        *5mAh

5    Operating distance   *0 meters, class two (one drag two)

6    Charging time            Less than 2 hours

7    Working time            About 6 hours

8    Music time                Up to 8 hours

9    Standby time            **0 hours

*0  Weight                      *8.5 g

*1  Dimension                *6**9.2**7.3 mm

*2  Total set                    *8 g
*3  Chipset                      CSR ***5 (import from England)



R&D capability

We has a professional R&D team, members own theoretical basis and practical experience in many years of acoustics, electronics related fields, engineering structure, fine mold design, automation and so on, familiar with the market demand and user experience, has a strong Innovative R&D capability. Besides, Qenla electronic has established closely relations of cooperation and maintain the technology to update the persistent with world-class Bluetooth chip manufacturers and professional Bluetooth institutions.

 

Equipment capability

Advanced manufacturing equipment capacity reflects the strength of manufacturing enterprises, Qenla own 3D mold structure development, Bluetooth circuit function R&D, assembly production and other keys, equipped with professional and technical team, has been independent of precision mold development technology, provide a guarantee for the rapid listing of new products.



Welcome your coming and nice to meet us at the GlobalSource Mobile Electronics Fair!



Booth number: *0S*3

Location: Hong Kong SAR

Date: April ****1, ***7



Shenzhen Qenla Electronic Technology Co. Ltd.

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To:

Ms. Jackie < Shenzhen Qenla Electronic Technology Co. Ltd. >

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