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6 inch SiC As-cut Wafer Manufacturer offer Un-Polished SiC Substrate

6 inch SiC As-cut Wafer Manufacturer offer Un-Polished SiC Substrate

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Minimum Order

Place of Origin:

-

Price for Minimum Order:

-

Minimum Order Quantity:

25 Piece

Packaging Detail:

Cassette

Delivery Time:

30days

Supplying Ability:

-

Payment Type:

T/T

今すぐお問い合わせください
Homray Material Technology Co., Ltd

Homray Material Technology Co., Ltd

China

無料会員

連絡先担当者 Mr. Kim

LiSheng Industrial Building,60 Suli Road, Soochow, Jiangsu

今すぐお問い合わせください

Description

6 inch SiC As-cut Wafer Manufacturer offer Un-Polished SiC Substrate

HMT company offer high quality 6 inch As cut SiC Wafer both for 4H-N and 4H-SI type. Raw-cut SiC wafers are cutting from SiC ingot but without lapping and polishing. Customers can purchase these un-processed SiC Wafers for their lapping and polishing machine testing. Please contact us for more specifications and quotaiton.

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Mr. Kim < Homray Material Technology Co., Ltd >

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