タイトルまたは説明

Introduction:

1.     TheBGA***0 has a integrated structure design and can repair different sizes of BGA, QFP, CSP and many more.

2.     The BGA***0 is equipped with an accurate Optical Position, Pick & Place System, and a Dark IR. Moreover this BGA station has a Reflow Soldering System, Software Control System and a Visional Inspection System.

Optical Position and Pick & Place System:

A.     The high-precision linear guide rail and turning platform to adjust the X, Y, Z direction and the nozzle.

B.    TheCCD, optical device and soft color splitting technology is composed of high precision optical mounting system, which can directly observe PCBs and overlapped chip PIN foots. The accurate positioningis easy to operate. The max BGA size which can be mount is *0x*0mm.

C.    A High-fi CCD camera provides a dual output signal of PAL and VGA. It involves an amplifier, micro-adjustment and is able to focus automatically. There is a software operation function for image BGA chip and PCBs on LCD with *0x optical zoom.

D.     The BGA***0s` mounting accuracy is ±0.*2mm.

Dark IR Reflow Soldering System:

The BGA***0 uses an upper and lower back dark IR heating system. The dark IR reflow soldering features as follows:
1. Rework table does not use infrared ordinary but the dark IR. Its wavelength is strictly controlled in **8 micron. Any color of the objects can be almost fully absorb by the IR in the range of wavelength
2. The rework is different from reflow. It is processed for a single component. There is no masking phenomenon, which features high thermal efficiency, no air disturbance, which makes it particularly suitable for repair work, especially BGA rework.

Software Control System:

A. High precision welding system: De-soldering and welding process is controlled by a computer software automatically, limitless different of settings of the temperature can be stored in the computer according to your requirements of welding technology curve and BGA rework curve.
B.Each technical curve can achieve the temperature curve simulations (*0 segments temperature curve control) to improve the quality of welding. At the same time, two temperature probes, one for thetemperature measurement and control of the heating region, and the other ensure sticking on the welded components to test the actual temperature for the amendments to the temperature value of the heating region.
C. The Reflow soldering temperature profile generates automatically and store your data in the computer. The data can be called at any time. Integrated LCD screen displays real-time temperature curve. Also shows two sets of temperature values　and working time.
D. AHigh-quality PC (Windows XP) system and BGA rework station system software, where you can set your reflow parameters according to the component characteristics.

Welding Visional Inspection System:

Uses industrial camera to view the whole technical process of reflow soldering of the BGA rework. You can see the solder ball melting process clearly for setting welding curve better and improve thus the welding quality effectively.

Spare Part and Accessories:

PC, BGA re-balling station, BGA template, solder ball, flux solder, de-soldering wick, clear Solution, forceps.

Technical Parameter:

Total power: 2.**0W
Hot air heating at top: **0W
Dark IR preheating: 1.**0W
Working Voltage: **0V, *0Hz
Control method: Manual/ automatic/ program
Mounting accuracy: +/- 0.*2mm
Position system: Double color soft light splitting technology
PCB size: Max: **0x**0mm, min *0x*0mm
PCB thickness: 0.5 - 3mm
Software control system: Based on WINDOWS control software
Mounting component size: Max *0x*0mm, min 1x1mm
Pick-up power: 2.0N
Temperature control system: Intelligent K type temperature control system, closed loop control.
PCB transmission: Software control, moves automatically.
PCB driving system: High-precision guide rail
Technical curve: segments temperature control
Inspection system: YES
Weight: *0kg
Dimension: ***0x**0x**0mm