タイトルまたは説明

Diamond wire saw for silicon wafer and sapphire cutting grinding polishing.
Diameter from 0.*6mm*0.5mm.
Grian size from ***0um.
Breaking load, we can do as your requirement.
For sapphire and SiC.
   0.*7mm/0.*2mm/0.*5mm used for the square root.
   0.*2mm/0.*3/0.*5mm used for slicing.
For silicon.
   0.*2mm/0.*7mm/0.*2mmused for the square root.
   *0um**0umused for slicing.
Other materials.
   Also can be applied to magnetic materail, ceramics, stone and other brittle materials cutting processing.