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Sanchao

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ホーム 会社 sanchao 製品

連絡先担当者 kriana

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製品: 2

Diamond wire saw for silicon wafer and sapphire cutting grinding polishing
Diamond wire saw for silicon wafer and sapphire cutting grinding polishing

Diamond wire saw for silicon wafer and sapphire cutting grinding polishing. Diameter from 0.06mm-0.5mm. Grian size from 5-50um. Breaking load, we can

今すぐお問い合わせください
Saw Silicon and sapphire ingot wafers
Saw Silicon and sapphire ingot wafers

Diamond wire saw for silicon wafer and sapphire cutting grinding polishing. Diameter from 0.04mm-0.5mm. Grain size from 5-50um. Breaking load, we can

今すぐお問い合わせください

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