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undefined,Other,China China
Diamond wire saw for silicon wafer and sapphire cutting grinding polishing. Diameter from 0.06mm-0.5mm. Grian size from 5-50um. Breaking load, we can
Diamond wire saw for silicon wafer and sapphire cutting grinding polishing. Diameter from 0.04mm-0.5mm. Grain size from 5-50um. Breaking load, we can
連絡先担当者 kriana
住所 undefined, Other
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