タイトルまたは説明

Base material: FR4 Layer count: double-sided board and single sided PCBBoard thickness: 1.6mm Copper thickness: 1oz Surface finish: immersion gold and lead-free HASLSolder mask colors: blackSize: **3.7 x *3.1/8 upTechnical parameters:

• Surface treatment: HASL (LF), immersion gold, flash gold, OSP, immersion tin, immersion silver, HASL and gold finger, selective nickelLaminates: CEM*3, PTFE, FR*4 (high TG and more), metal base (AL, CU and more), rogers and moreMaximum layers: *6 Maximum board dimensions: *0 x *8 inchesBoard thickness: 0.4 to 5.5mmMaximum copper thickness:
  • Inner layer: 4ozOuter Layer: 5oz
  Minimum track width: 4 mils/0.1mmMinimum track space: 4 mils/0.1mmMinimum hole size: 8 mils/0.2mmMinimum laser hole size: 4 mils/0.1mmPTH wall thickness: 0.8 mils/*0umPTH diameter tolerance: ±3 mils/±*6umNPTH diameter tolerance: ±2 mils/±*0umAspect ratio: *0:1Impedance control: ±*0%