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Cirket Electronics Company

Add.:3F,Block B1,HengFeng Ind.Zone,Hezhou,Xixiang,BaoAn,Shenzhen, Guangdong, 518128, P.R.China,Shenzhen,Guangdong,China China

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ホーム 会社 Cirket Electronics Company 製品

連絡先担当者 jessie mao

住所 Add.:3F,Block B1,HengFeng Ind.Zone,Hezhou,Xixiang,BaoAn,Shenzhen, Guangdong, 518128, P.R.China, Shenzhen, Guangdong

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製品: 8

CKTSMT000103

Specifications: Base material: FR4 Layers count: four Board thickness: 1.6mm Copper thickness: 1oz Surface finishing: immersion and gold finger

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Printed Circuit Board Assembly with Gold Finger Surface and 4 Layers f

Specifications: Base material: FR4 Layers count: four Board thickness: 1.6mm Copper thickness: 1oz Surface finishing: immersion and gold finger

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HASL Printed Circuit Board with Immersion Gold Finger, 0.2mm Minimum B

Base materials: FR4, aluminum, FPC and copper Minimum copper thickness: 0.5oz Maximum copper thickness: 4oz Minimum board thickness: 0.2mm Maximum

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Lead-free HASL Single-sided PCB with 1oz Copper Thickness and Sized 15

Base material: FR4 Layer count: double-sided board and single sided PCBBoard thickness: 1.6mm Copper thickness: 1oz Surface finish: immersion gold and

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LED Light PCB with FR4 Base Material, 1.2mm Board and 1oz Copper Thickness

Specifications: Base material: FR4 Layer count: double-sided board Board thickness: 1.2mm Copper thickness: 1oz Surface finish: HASL Soldermask color:

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PCBA, Sheet Metal Stamping and Punching, Painting Lines

Specifications: Applicable PCB (L x W): 50 50 to 700 460mm Minimum component: 0201 Minimum QFP pitch: 0.4mm Minimum IC pitch: 0.30mm Minimum B

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Video Capture Board with Gold Finger and 0.5oz Minimum Copper Thickness

Base materials: FR4, aluminum, FPC and copper Minimum copper thickness: 0.5oz Maximum copper thickness: 4oz Minimum board thickness: 0.2mm Maximum boa

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jessie < Cirket Electronics Company >
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