NO.

ITEM

INDEX

*1

Surface treatment

HAL(lead free), Immersion Gold, OSP

*2

Layer

Single-sided, double-sided, multilayer and special structure layer

*3

Max size

***0mm***0mm

*4

PCB thickness

0.**3.3mm

*5

Copper foil thickness

H 1 2 3 4 5 6 *0(OZ)

*6

Insulating layer thickness

*0 *5 **0 **5 **0 micron

*7

Metal base type

Aluminum，Ferrum，Copper，Stainless steel

*8

Metal base thickness

0.5 0.8 1.0 1.2 1.5 2.0 3.0 3.2 (mm)

*9

Shaping

Die Punching, CNC Route, CNC V-Cut

*0

Testing

**0% Compute Short/Open Circuit Test

*1

The Minimum Hole Diameter

single-sided 0.8mm, PTH 0.3mm

*2

The Minimum Pad Size

1.2mm

*3

The Minimum PTH Distance

2.0mm

*4

The Minimum Line Width

0.1mm

*5

The Minimum Increase of Solder Mask

0.*5mm

*6

The Minimum Pad

*0um

*7

Solder Mask Color

green, white, black, red, yellow

*8

The Minimum Letter Width

0.*5mm

*9

The Minimum Letter Height

0.8mm

*0

Letter Color

white, black, blue, yellow, red