タイトルまたは説明

YH**3 Thermal Conductivity 2.0～3.0 (W/m.k) Peel Strength ≥1.8 (N/mm) After thermal stress Blister Test after Thermal Stress **0℃ 2min After thermal impact Flammability UL*4 V*0 Thermal resistance max ≤0.*5 (℃/W) Surface Resistivity ≥5×**6 (MΩ.m)Constant humidity treatment (*0%, *5 ℃, *6H) Volume Resistivety ≥1.8×**7 (MΩ.m) (*0%, *5 ℃, *6H) Dielectric Breakdown min ≥3.0 (KV) Dielectric Constant ≤2.5 (1MHz) (*0 ℃, *0%, *6H) Dissipation Factor ≤0.*3(*0 ℃, *0%, *6H)