Printed Circuit Board(Thick nickel-aurum aluminum board+Gold Plating))

タイトルまたは説明

Board Thickness：0.6mm aperture: 0.4mm Cu thickness: 1/1 oz Au thickness :0.2um impedance: / Apply: communication equipment conductor spacing: 5mil Base Material : Aluminum-substrate Surface Treatment : Plating gold Remark: Thick AU (AU>0.2UM) Our Capability: Layer:***0 layers Material:FR4, CEM1, CEM3, FR2, Aluminium base Copper Thickness:1/3OZ*4OZ Board thickness:0.***3.2mm Min line width/spacing:0.1/0.1mm Min drilling hole size:0.*0mm Advanced Technologies: Blind/Buried Via, HDI Micro via Surface Finishing:HAL, HAL(Lead-free), Gold plating, Immersion Gold/Sliver/Tin, ENIG, OSP Certificates:ISO***1, UL, ROHS Price: Quite competitive especially for orders in huge quantities Advantage: Good quality with reasonable price; quick delivery; without limitation for the ordering qty.