Thin Polyimide Bendable FPC With FR4 Stiffener

タイトルまたは説明

Material  type: polyimide

Layer count: 2

Min trace width/space: 4 mil

Min hole size: 0.*0mm

Finished board thickness: 0.*0mm

Finished copper thickness: *5um

Finish: ENIG

Solder mask color: red

Lead time: *0 days

 

The advantage of FPC:

1. It can be bent, wound and folded freely, arranged in accordance with the requirements of spatial layout, and moved and expanded arbitrarily in three-dimensional space, so as to achieve the integration of component assembly and wire connection;

2. The use of FPC can greatly reduce the volume and weight of electronic products, adapt to the development of electronic products towards high density, miniaturization, high reliability.

FPC circuit board also has the advantages of good heat dissipation and weldability, easy installation and low comprehensive cost. The combination of flexible and rigid board design also makes up for the slight deficiency of flexible substrate in the bearing capacity of components to some extent.