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Dongguan Cona Electronic Technology Co., Ltd.

4th Floor, Building A, 2nd West side, West zheng 2nd Road, Shajiao Community,Dongguan,Guangdong,China China

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ホーム 会社 Dongguan Cona Electronic Technology Co., Ltd. 製品

連絡先担当者 Ms. Helen Song

住所 4th Floor, Building A, 2nd West side, West zheng 2nd Road, Shajiao Community, Dongguan, Guangdong

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製品: 8

6 LAYER IMPEDANCE CONTROL RIGID-FLEX BOARD WITH STIFFENER
6 LAYER IMPEDANCE CONTROL RIGID-FLEX BOARD WITH STIFFENER

Material type: FR-4, polyimide Min trace width/space: 4 mil Min hole size: 0.15mm Finished board thickness: 1.6mm FPC thickness: 0.25mm Finished

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COPPER SUBSTRATE PCB FOR OUTDOOR LIGHTING
COPPER SUBSTRATE PCB FOR OUTDOOR LIGHTING

Onelayerboard, boardthickness:2.0mm; FinishedCopperthickness: 35um, Finish: ENIG Application ofMCPCB 1. Audio : Input, ...

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Thin Polyimide Bendable FPC With FR4 Stiffener
Thin Polyimide Bendable FPC With FR4 Stiffener

Material type: polyimide Layer count: 2 Min trace width/space: 4 mil Min hole size: 0.20mm Finished board thickness: 0.30mm Finished copper thickness:

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1.6MM FAST PROTOTYPE STANDARD FR4 PCB
1.6MM FAST PROTOTYPE STANDARD FR4 PCB

Material type: FR-4 Layer count: 2 Min trace width/space: 6 mil Min hole size: 0.40mm Finished board thickness: 1.2mm Finished copper thickness:

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SINGLE SIDED IMMERSION GOLD CERAMIC BASED BOARD
SINGLE SIDED IMMERSION GOLD CERAMIC BASED BOARD

Material type: ceramic base Layer count: 1 Min trace width/space: 6 mil Min hole size: 1.6mm Finished board thickness: 1.00mm Finished copper thi

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RESIN PLUGGING HOLE MICROVIA IMMERSION SILVER HDI WITH LASER DRILLING
RESIN PLUGGING HOLE MICROVIA IMMERSION SILVER HDI WITH LASER DRILLING

Material type: FR4 Layer count: 4 Min trace width/space: 4 mil Min hole size: 0.10mm Finished board thickness: 1.60mm Finished copper thickness: 35um

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3 Oz Solder Mask Plugging ENEPIG Heavy Copper Board
3 Oz Solder Mask Plugging ENEPIG Heavy Copper Board

Heavy Copper PCBs are extensively used in the Power Electronics and Power Supply systems where there is a high current requirement or a possibility of

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FAST MULTILAYER HIGH TG BOARD WITH IMMERSION GOLD FOR MODEM
FAST MULTILAYER HIGH TG BOARD WITH IMMERSION GOLD FOR MODEM

Material type: FR4 Tg170 Layer count: 4 Min trace width/space: 6 mil Min hole size: 0.30mm Finished board thickness: 2.0mm Finished copper thickness:

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Ms. Helen < Dongguan Cona Electronic Technology Co., Ltd. >
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