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Los Angeles,California,China China
PRODUCT DESCRIPTION Black core FR4 , 5mil/5mil, Solder mask is transparent Base Material 2L, Black coreFR4, VT-42 Laminate, TG140 Board Thickness 1.8
PRODUCT DESCRIPTION surface treatment:ENIG difficulty:Single Cu-base with ENIG Other: custom
PRODUCT DESCRIPTION Layer Count: 8 Layer (2+4+2, 1 level HDI) Rigid-Flex Structure: 6R+2F Material: Nanya FCCL, ITEQ FR-4 Tg150, 94V-0, RoHS Finished
PRODUCT DESCRIPTION Board Thickness 0.07-0.40mm Base Material 0.5mil - 2mil Polyimide Copper Thickness 0.5OZ-2OZ Stiffener PI: 0.10-0.25UM, Fr4: 0.1-.
PRODUCT DESCRIPTION Quick Details:3mil/3mil, HDI , Impedance control, Half Holes Base Material Fr4 TG170 Board Thickness 1.0 mm Copper Thickness 1OZ
PRODUCT DESCRIPTION PCBA Application Industrial control equipment CHIP Size 0402 QFP Pin Spacing 0.4mm QFN Pin Spacing 0.4mm BGA Ball Sp...
PRODUCT DESCRIPTION Taconic TLY-5 Base Material Taconic TLY-5 Board Thickness 1.52 mm Copper Thickness 1OZ DK 2.2 DF 0.0009 Solder ...
PRODUCT DESCRIPTION Quick Details:3mil/3mil, HDI , Impedance control, Half Holes Base Material Fr4 TG170 Board Thickness 1.6 mm Copper Thickness 4OZ
PRODUCT DESCRIPTION Quick Details: 4OZ, TG170, 12mil /12mil Base Material Fr4 TG170 Layer Counts 12L Board Thickness 3.2mm Copper Thi...
PRODUCT DESCRIPTION Teflon Diclad 527 Board Thickness 0.5 mm Base Material Teflo...
連絡先担当者 Jalina He
住所 Los Angeles, California
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