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fuyong,shenzhen,guangdong,China China
連絡先担当者 Mr. sky xiong
住所 fuyong, shenzhen, guangdong
Min. Hole Diameter 0.5mm Min. Hole to Hole Tol. ±1mil Min. L/Width L/spacing 4 mil Solder
Shenzhen Hengtaida Technology Co, .Ltd deals in the development and production of printed circuit boards (PCB)
layer:Rigid 8Layers, Flexible 4Layers material:PI+FR4 Board thickness: Rigid 1.0mm, Flexible
layer:Rigid 4Layers, Flexible 1 Layers material:PI+FR4 Board thickness: Rigid 1.6mm, Flexible
layer:4 material:FR4 TG170 Board thickness: 0.6mm Surface finish:immersion g
layer:6 material:FR4 Board thickness: 1.0mm Surface finish:immersion gold Mi
layer:6 material:FR4 Board thickness: 1.6mm Surface finish:lead free HAL+gold
layer:12 material:FR4 Board thickness: 1.6mm Surface finish:flash gold Min t
used for medical area single side Min. Hole Diameter 0.2mm Min. L/W L/Spacing 3mil Min. Annular Ring Wid
layer:2 materialï¼?FR4 Board thickness: 4.8mm Surface finishï&Aci
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