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chaguang road,Shenzhen,Guangdong,China China
SMT+DIP minimum space size: 0.5mm ROHS complaint No. of IC: *8pcs Soldering components: ***8pcs Minim
PCBA Technical discription: SMT+DIP minimum space size: 0.5mm ROHS complaint No. of IC: 6pcs Solder
SMT+DIP minimum space size: 0.3mm ROHS complaint No. of IC: *2pcs Soldering components: **8pcs Minimu
SMT+DIP minimum space size: 0.5mm ROHS complaint No. of IC: *9pcs Soldering components:**2pcs Minimum
SMT+DIP minimum space size: 0.8mm ROHS complaint No. of IC: 6pcs Soldering components: *6pcs Minimum
PCBA Technical discription: SMT+DIP minimum space size: 0.5mm ROHS complaint No. of IC: 9pcs Solder
SMT+DIP minimum space size: 0.3mm ROHS complaint No. of IC: *3pcs Soldering components: **6pcs Minimu
PCBA Technical discription: SMT+DIP minimum space size: 0.5mm ROHS complaint No. of IC: *6pcs Solde
SMT+DIP minimum space size: 0.5mm ROHS complaint No. of IC: *3pcs Soldering components: ***6pcs Minim
layer:6 material:FR4 Board thickness: 1.5mm Surface finishlead free HAL Min through hole0.**5mm(3mil) M
layer:*8 material FR4 Board thickness: 1.8mm Surface finish lead free HAL Min through hole 0.**5mm(3m
layer:*8 material FR4 Board thickness: 1.8mm Surface finish lead free HAL Min through hole 0.*5mm(*0m
layer:8 material FR4 Board thickness: 1.6mm Surface finish osp+gold finger Min through hole 0.**5mm(3
layer:*2 material FR4 Board thickness: 2.2mm Surface finish lead free HAL Min through hole 0.*5mm(*0m
layer:*6 materialFR4 Board thickness: 1.6mm Surface finishlead free HAL Min through hole0.**5mm(3mil) M
layer:8 materialFR4 Board thickness: 1.0mm Surface finishimmersion gold+ half hole Min through hole0.**
layer:2 material FR4 Board thickness: 2.0mm Surface finish immersion gold Min through hole 0.3mm(*2mi
layer:2 material Rogers Board thickness: 1.6mm Surface finish immersion gold Min through hole 0.4mm(*
layer:*2 material FR4 Board thickness: 1.6mm Surface finish immersion silver Min through hole 0.**5mm(
連絡先担当者 gloria zhu
住所 chaguang road, Shenzhen, Guangdong
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