FOB Price
Get Latest Price|
Minimum Order
Place of Origin:
-
Price for Minimum Order:
-
Minimum Order Quantity:
-
Packaging Detail:
-
Delivery Time:
-
Supplying Ability:
-
Payment Type:
-
連絡先担当者 Mr. Huang
No.205, Hongdu Office Building, Fanshen Road, ShenZhen, Guangdong
Key Specifications/Special Features: Layer No.: 8 Surface finished: ENIG + OSP Board thickness: 1.0mm Array size: 9.**6 x 4.**0 inches Thru via size: 0.*0mm Application: mobile phone HDI structure: 1 + 6 + 1 Min. BGA ball pitch: **0um Min. SMD pad pitch: **0um Material type: FR4, HTG Min. line width: **0um Min. line space: **0um